Job Code 1
BGA Solderer
Posted 23 Jul 2026Apply by 30 Sep 2026
Apply for this jobRole Overview
Job Description:
A BGA Solderer is responsible for soldering, repairing, and reworking Ball Grid Array (BGA) components on printed circuit boards (PCBs). The role requires precision and attention to detail to ensure high-quality electronic assemblies.
Key Responsibilities:
Solder and rework BGA components on PCBs.
Inspect solder joints and ensure they meet quality standards.
Perform repairs and rework on electronic circuit boards when needed.
Use BGA soldering and rework equipment safely and correctly.
Follow work instructions and quality procedures.
Keep the work area clean and organized.
A BGA Solderer is responsible for soldering, repairing, and reworking Ball Grid Array (BGA) components on printed circuit boards (PCBs). The role requires precision and attention to detail to ensure high-quality electronic assemblies.
Key Responsibilities:
Solder and rework BGA components on PCBs.
Inspect solder joints and ensure they meet quality standards.
Perform repairs and rework on electronic circuit boards when needed.
Use BGA soldering and rework equipment safely and correctly.
Follow work instructions and quality procedures.
Keep the work area clean and organized.
Requirements
BGA Solderer 2 (CV+Online interview)
Benefits
Flight tickets (return) and accomodation is paid by Employer. The description does not take into account the average 15% shift allowance, the overtime and performance-based monthly bonus.
food allowance: net 20.000.- HUF.
food allowance: net 20.000.- HUF.
Applicant Eligibility
Filipino